A proposed model-driven approach to manage architectural technical debt life cycle

Boris Perez, Dario Correal, Hernan Astudillo

Producción científica: Contribución a los tipos de informe/libroContribución a la conferenciarevisión exhaustiva

7 Citas (Scopus)

Resumen

Architectural Technical Debt (ATD) is a metaphor used to describe consciously decisions taken by software architects to accomplish short-term goals but possibly negatively affecting the long-term health of the system. However, difficulties arise when repayment strategies are defined because software architects need to be aware of the consequences of these strategies over others decisions in the software architecture. This article proposes REBEL, a semi-automated model-driven approach that exploits natural language processing, machine learning and model checking techniques on heterogeneous project artifacts to build a model that allows to locate and visualize the impact produced by the consciously injected ATD and its repayment strategy on the other architectural decisions. The technique is illustrated with a data analytics project in Colombia where software architects are unaware of the consequences of the repayment strategies. This proposal seeks to support teams of architects to make explicit the current and future impact of the ATD injected as a result of decisions taken, focusing on the architectural level rather than code level.

Idioma originalInglés
Título de la publicación alojadaProceedings - 2019 IEEE/ACM International Conference on Technical Debt, TechDebt 2019
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas73-77
Número de páginas5
ISBN (versión digital)9781728133713
DOI
EstadoPublicada - may. 2019
Publicado de forma externa
Evento2nd IEEE/ACM International Conference on Technical Debt, TechDebt 2019 - Montreal, Canadá
Duración: 26 may. 201927 may. 2019

Serie de la publicación

NombreProceedings - 2019 IEEE/ACM International Conference on Technical Debt, TechDebt 2019

Conferencia

Conferencia2nd IEEE/ACM International Conference on Technical Debt, TechDebt 2019
País/TerritorioCanadá
CiudadMontreal
Período26/05/1927/05/19

Áreas temáticas de ASJC Scopus

  • Gestión tecnológica y de innovación
  • Hardware y arquitectura
  • Software
  • Seguridad, riesgos, fiabilidad y calidad

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